{
  "revision": "R15",
  "CAD_date": "2026-10-10",
  "publication_date": "2026-10-12",
  "source_pcb_sha256": "61e693734a11f87cc2719fc4030975bb590dee46df228db0d5de3316b03ea035",
  "copper_layers": 6,
  "inner_DGND_reference_planes": 2,
  "outline_mm": [
    53,
    83
  ],
  "footprints": 81,
  "component_bodies": 75,
  "tracks": 720,
  "vias": 298,
  "widened_power_ground_segments": 437,
  "main_inner_3V3_width_mm": 4.8,
  "main_inner_12V_width_mm": 4.2,
  "native_PCB_check": {
    "physical_violations": 0,
    "disconnected_items": 0,
    "schematic_parity": 0,
    "check_date": "2026-10-10",
    "settings": "Retained project settings; strict validation has four inherited footprint-filter warnings."
  },
  "unchanged_schematic_ERC": {
    "unused_pin_errors": 210,
    "off_grid_warnings": 13
  },
  "assembly": "Simplified XEM above MC1\u2013MC3 at nominal 5mm gap; Gerald LDO below J1/J19 at nominal 2mm gap. Source-derived outline and component envelopes; fitted seating unqualified.",
  "fabrication_release": false,
  "remaining": [
    "Electrical/current/thermal/timing qualification",
    "USB/JTAG/ESD functional checks and EEPROM provisioning",
    "Populated mating and fastener tolerance review",
    "Manufacturing acceptance"
  ],
  "public_native_package": "Model-only adaptation; schematic/electrical/layout geometry preserved, supplier model payloads omitted."
}