# Current interactive reviews · R39 update, 5 October 2026

[35T FPGA R39](../fpga/current-35t.html) · [dated R37](../fpga/review-r37-2026-10-04.html) · [LDO adapter E5](../ldo-backup/current-e5.html) · [XEM8305 A1R2](../xem/current-a1r2.html) · [bonding fixture V6](../library/bonding-fixture.html) · [project Library](../library/).

These four previews support rotation, zoom, pan, top/bottom/side views and reset. The existing local Three.js, OrbitControls and GLTFLoader libraries are reused; no external browser service is required. The PNG fallback and library thumbnails belong to the same dated review set. Viewer geometry is centered and scaled for inspection at runtime.

R39 publishes fresh native PNG/SVG views, lightweight WebP previews, a headboard-only browser mesh and a [complete native KiCad project](../downloads/). Its public package includes ownership/model notices and excludes supplier reference collections, internal scripts/notes and private correspondence. Earlier dated browser assets remain unchanged. [provenance.json](provenance.json) records the actual included asset hashes, source revisions, transformations and omissions.

| Preview | Source and limitations |
|---|---|
| 35T R39 · current | Exact saved 41 × 41 mm headboard alone, with existing partial surface copper. All 315 placed package-model references are included from the same 34 known model assets as R37. The preview loads on request and stops drawing while idle/offscreen. Native 1.6 mm thickness remains a placeholder. No lower mating template, future routes, vias or planes are added; issued HDI construction, routing, timing and assembled qualification remain incomplete. |
| 35T R37 · preserved | XC7A35T-2CSG325I current 41 × 41 mm research placement, including the five capacitor placement changes. Headboard plus connector-only mating template, with routing hidden. The lower template is not a functional LDO board. Routing, ASIC timing, populated fit, retention and manufacturing acceptance remain open. Earlier paused R35 routing and September 29 25T placement retain separate counts and status. |
| LDO E5 | Native E5 export with the separate J4 locking JST GH power connector. J1/J19/J3 housing models and inner copper are omitted; their pad geometry remains. A local export meshing warning means surface copper graphics may be incomplete. Power stays off the signal flex, with J19 intentionally unconnected. Current requirement, analog return, cable/connector fit and powered operation remain unqualified. |
| XEM8305 A1R2 | Current carrier assembly with both physical J1/J19 mating pairs. Includes the dated E3 adapter, source LDO, nominal connector envelopes and provisional cable. The E5 adapter is a separate current review; XEM8310 protected-power schematic work is a separate project. The superseded E2 board and unknown protrusion geometry are omitted. Cable and connector fit remain provisional. |
| Bonding V6 | Exact one-piece frame mesh converted from the saved V6 STL to glTF Y-up metres. No PCB, ASIC, installed stage, seal or vacuum hardware is added. The PNG separately shows the loaded-board reference. Fit-check prototype only; vacuum sealing and bonding stability remain untested. |

## Credits

KiCad library model bodies follow the [existing KiCad library license and generated-files exception](../fpga/3d/assets/KiCad-LICENSE.md). E5 J4 uses the source model by **Frank Severinsen, © 2018**, under [CC-BY-SA 4.0](https://creativecommons.org/licenses/by-sa/4.0/legalcode) with the [KiCad electronic-design/generated-files exception](https://github.com/KiCad/kicad-packages3D/blob/master/LICENSE.md). It is a library geometry reference, not manufacturer fit acceptance.

The XEM8305 module visual derives from [Opal Kelly’s published 3D models](https://www.opalkelly.com/products/models/). Manufacturer geometry is retained for orientation and identified separately from the project’s carrier, adapter, cable and nominal mating envelopes. Three.js remains covered by its [included MIT license](../fpga/3d/vendor/LICENSE).

## Direct XEM8305 R2 · 5 October 2026

The [preserved direct R2 review](../xem/direct-r2-2026-10-05.html) shows native top/underside KiCad vectors and an explicitly loaded carrier-only 3D model. Native board, pads and surface copper are preserved; the five socket boxes are original project-authored nominal envelopes for position and side. Other component bodies, manufacturer connector bodies and the assembled XEM/LDO stack are omitted. These boxes do not qualify housing shape, mating height, simultaneous seating or fit.

The [complete native package and four-page schematic](../downloads/#xem8305-direct-r2) match the frozen R2 revision. Public packaging omits the two embedded Samtec ERF6 payloads and externalizes only their model references. All non-model native semantics are preserved and fresh extracted-copy ERC/DRC/opens/parity checks are zero. The all-260-contact audit records MC3 as 28 DGND plus 52 explicitly reserved no-connects. Factory DFM, ASIC/FPGA timing, power/load/thermal, actual fit, firmware and powered operation remain unqualified. The earlier R39 and A1R2/E5 asset bytes are preserved.

Samtec [website terms](https://suddendocs.samtec.com/articles/samtec-website-terms-of-use.pdf) and the [ERF6 model disclaimer](https://www.samtec.com/products/erf6) do not evidence permission to redistribute the supplied model bodies; they are not included. Project-authored board/footprint geometry remains identified separately from manufacturer 3D content. The existing KiCad and Three.js notices are retained.

## Direct XEM8305 R3 · 5 October 2026

The [R3 review and downloads](../xem/direct-all-connectors-2026-10-05.html) contain the eight-sheet schematic, native KiCad ZIP, Gerber/drill ZIP and one combined download. Native geometry comes from the frozen six-layer carrier. Public packaging documents removal of manufacturer model payloads and preserves circuit/board semantics; fresh extracted-project ERC/DRC/opens/parity are zero. The schematic PDF has separately documented print-layout adjustments with identical component/net topology.

The carrier-only GLB preserves native board/pads/outer copper geometry and adds63 original nominal fitted-component envelopes at the source footprint centers/angles. R5 DNP and mount/wire features have no component bodies. Inner copper, exact manufacturer housings and the assembled XEM/LDO stack are omitted. Standard KiCad dependencies/notices and the project-authored nominal Murata body are documented in the native ZIP. [3D recipe and omissions](assets/2026-10-05/xem8305-direct-r3/Public_R3_3D_Receipt.json) give source-bound details.

All144 actualCAM checks and766 actualpaste/mask/outline checks pass. Factory production acceptance, part sourcing/rotation/reflow and first-board fitting, power, timing and operation remain open. Publication is not an approved assembled-board order. Earlier R2/R39 download and model assets are preserved.