XEM8305 direct carrier R3 — public review package, 5 October 2026

One six-layer carrier design, 53 x 83 mm, in a 73 x 83 mm one-up assembly handling panel.

Extract XEM8305_Direct_R3_Native_2026-10-05.zip completely before opening hardware/LDO_to_XEM8305_Direct_R3.kicad_pro in KiCad 10.0.6. All eight schematic sheets and local symbol/footprint libraries are included. Public packaging excludes manufacturer model payloads and documents model dependencies. The circuit and board geometry match the checked source.

The separate Gerbers_Drill ZIP contains fabrication layers/drills and required process notes. Select the stated six-layer 1.6 mm stack and epoxy-filled/capped all 0.30 mm vias. Read FABRICATION_NOTES.txt inside that ZIP. The handling rails are removed after assembly. Quantity is selected at order.

The GLB uses native board/pads/surface copper and project-authored nominal component envelopes. It is a position/side preview; exact component housing geometry and the assembled XEM/LDO stack are omitted.

Local CAD/CAM checks pass. Factory DFM, exact assembly parts/rotations/process acceptance and first-board fit/power/ASIC tests remain pending. This is a prototype review/fabrication package, not an approved assembled-board order. Initial R5 ARM is DNP/off; aggregate VCCO commissioning ceiling is 50 mA pending measured bank voltages.
