XEM8305 direct carrier R3 — fabrication instructions

One design; one-up customer assembly panel 73 x 83 mm. Finished carrier 53 x 83 mm with 10 mm removable left and right rails. Quantity is selected separately at order.
6-layer FR-4, 1.6 mm finished nominal, named JLC06161H-3313 stackup, 1 oz outer / 0.5 oz inner copper, green solder mask, white silkscreen, ENIG.
CNC-route outer 73 x 83 mm rectangle. The two full-height internal lines marked V-CUT in the same outline GM1 are DOUBLE-SIDED 25-degree V-cuts at X=10 and X=63 mm from the panel lower-left drill origin. Do not CNC-route these two lines.
Select EPOXY-FILLED & CAPPED for ALL 0.30 mm PTH VIA holes only. Do not fill NPTH mounting/alignment/tooling holes or component holes. Verify this selection in production files before manufacture.
Top-to-bottom copper order: F.Cu / In1.Cu / In2.Cu / In3.Cu / In4.Cu / B.Cu. All Gerber and drill files share the panel lower-left origin.
This package has local native/CAM checks, not factory DFM approval. For assembly, exact part sourcing, placement preview, stencil/reflow/support and panel production-file acceptance remain separate.
Prototype validation: native checks do not qualify actual load, ASIC timing or fit. R5 ARM is DNP/off. Aggregate VCCO commissioning limit is 50 mA pending measured bank voltage and return/contact drop.
