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Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics
DS181 (v1.27.1) July 3, 2024
Product Specification 2
 
VIN Receiver (RXP/RXN) and Transmitter (TXP/TXN) absolute input voltage –0.5 1.26 V
IDCIN-FLOAT DC input current for receiver input pins DC coupled RX termination = floating – 14 mA
IDCIN-MGTAVTT DC input current for receiver input pins DC coupled RX termination = VMGTAVTT – 12 mA
IDCIN-GND DC input current for receiver input pins DC coupled RX termination = GND – 6.5 mA
IDCOUT-FLOAT DC output current for transmitter pins DC coupled RX termination = floating – 14 mA
IDCOUT-MGTAVTT DC output current for transmitter pins DC coupled RX termination = VMGTAVTT – 12 mA
XADC
VCCADC XADC supply relative to GNDADC –0.5 2.0 V
VREFP XADC reference input relative to GNDADC –0.5 2.0 V
Temperature
TSTG Storage temperature (ambient) –65 150 °C
TSOL
Maximum soldering temperature for Pb/Sn component bodies(6) –+ 2 2 0 ° C
Maximum soldering temperature for Pb-free component bodies(6) –+ 2 6 0 ° C
Tj Maximum junction temperature(6) –+ 1 2 5 ° C
Notes: 
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, 
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. 
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. The lower absolute voltage specification always applies.
3. For I/O operation, refer to 7 Series FPGAs SelectIO Resources User Guide (UG471).
4. The maximum limit applies to DC signals. For maximum undershoot and overshoot AC specifications, see Table 4.
5. See Table 9 for TMDS_33 specifications.
6. For soldering guidelines and thermal considerations, see 7 Series FPGA Packaging and Pinout Specification (UG475).
Table  2: Recommended Operating Conditions(1)(2)
Symbol Description Min Typ Max Units
FPGA Logic
VCCINT(3)
For -3, -2, -2LE (1.0V), -1, -1Q, -1M devices: internal supply voltage 0.95 1.00 1.05 V
For -1LI (0.95V) devices: internal supply voltage 0.92 0.95 0.98 V
For -2LE (0.9V) devices: internal supply voltage 0.87 0.90 0.93 V
VCCAUX Auxiliary supply voltage 1.71 1.80 1.89 V
VCCBRAM(3)
For -3, -2, -2LE (1.0V), -2LE (0.9V), -1, -1Q, -1M devices: block RAM supply 
voltage
0.95 1.00 1.05 V
For -1LI (0.95V) devices: block RAM supply voltage 0.92 0.95 0.98 V
VCCO(4)(5) Supply voltage for HR I/O banks 1.14 – 3.465 V
VIN(6)
I/O input voltage –0.20 – V CCO +0 . 2 0 V
I/O input voltage (when VCCO = 3.3V) for VREF and differential I/O standards 
except TMDS_33(7)
–0.20 – 2.625 V
IIN(8) Maximum current through any pin in a powered or unpowered bank when 
forward biasing the clamp diode.
–– 1 0m A
VCCBATT(9) Battery voltage 1.0 – 1.89 V
GTP Transceiver
VMGTAVCC(10) Analog supply voltage for the GTP transmitter and receiver circuits 0.97 1.0 1.03 V
VMGTAVTT(10) Analog supply voltage for the GTP transmitter and receiver termination circuits 1.17 1.2 1.23 V
Table  1: Absolute Maximum Ratings(1) (Cont’d)
Symbol Description Min Max Units
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